High-reliability granular copper plating additive that achieves high adhesion to sealing resin.
Granular copper plating film for lead frames that contributes to the improvement of adhesion strength with sealing resin.
Power semiconductors that can operate in high-load environments are used in various fields such as industrial equipment, solar power generation, electric vehicles, communication devices, and energy conversion equipment. In recent years, as high voltage and high current capabilities have advanced, there is a growing need for packaging technologies that offer higher connection reliability. If the lead frame, which connects the semiconductor device and circuit, experiences delamination at the interface of the substrate resin under thermal load, it can lead to short circuits or disconnections. Our company has newly developed an additive that forms a granular copper plating to achieve high adhesion between the frame, coating, and mold resin.
- Company：奥野製薬工業 大阪・放出、東京、名古屋など
- Price：Other
